SSPLAXFab Throughput Ramp
Which tool constraint limits output, and what becomes the next limit after it is relieved?
Model map
The governing limit is highlighted
Current qualified output
~10,500 wafers/month
Governing limit
Lithography fully loaded
First move: +10% lithography
Output rises to ~11,000/month
Situation
Wafer starts pass through lithography, metrology, and probe/test before they count as qualified output.
Model logic
Raises each tool constraint in turn and resolves the fab flow to find the first useful capacity move.
More budget does not increase output while scanner capacity is fixed.
A 10% lithography increase raises qualified output to about 11,000 wafers/month.
Metrology becomes the next bottleneck after lithography is relieved.
Increase lithography capacity by 10% to reach about 11,000 wafers/month; plan metrology capacity next.