Fab Tool Capacity

Wafer starts move through lithography, etch/deposition, metrology, and probe/test. Each stage has its own capacity, yield loss, cost, and carbon load, so the best next move depends on the active tool limit.

Decision logic

Identify which fab tool family governs qualified wafer output and what constraint becomes binding after the first unlock.

Decision question

Which tool bottleneck unlocks the most qualified wafer output this month?

Model output

Best first unlock+1 lithography shift

Current good output~9.3k wafers/month

Next limitMetrology becomes binding

Active limits

Lithography fully loaded
Metrology near limit

Key insight

Lithography is the first wall; once scanner capacity opens, metrology becomes the next governing limit rather than budget.

Adding budget alone does not raise qualified wafers while scanner capacity is fixed.

A lithography shift opens immediate output, then inspection capacity starts to matter.

The next capital request should be sequenced from scanner relief to metrology coverage.

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